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13
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA01
ISSUE E
NOTES:
1.  DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2.  CONTROLLING DIMENSION: MILLIMETERS.
3.  DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4.  COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C
0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C
0.10
C
0.10
C
0.08
NOTE 4
A1
SEATING
PLANE
e/2
e
8X
K
NOTE 3
b
8X
0.10   C
0.05   C
A
B
B
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.20
0.30
D
2.00 BSC
D2
1.10
1.30
E
2.00 BSC
E2
0.70
0.90
e
0.50 BSC
K
L
0.25
0.35
1
4
8
5
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
0.50
8X
DIMENSIONS: MILLIMETERS
0.30
PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
L1

0.10
0.30 REF
0.90
1.30
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